IPC TM-650

Switch to solutions by

A suite of test methods for printed circuit boards. Visual, dimensional, chemical, mechanical, electrical, environmental. To determine the release strength of the carrier of thin copper foil in pounds per inch of width at ambient temperature

Standards

Featured or equivalent test standards for Mecmesin solutions in this section

IPC-TM-650 Test Methods - Carrier ReleaseThin Copper

PCB Copper Track 90 Degree Peel

Case study

IPC TM-650

MB PCB copper peel close up printed circuit board

Having an in-house test capability is essential when developing new processes and products. Having the Mecmesin tester at Cambridge Nanotherm has allowed us to reduce test cycles significantly. The software package also gives us the ability to analyse the subtle differences in adhesion mechanisms and also gives us the ability to produce detailed reports for our suppliers and customers.

Steven Curtis, Chief Engineering Officer
Cambridge Nanotherm Ltd

Case study

printed circuit board PCB 90 degree copper track adhesive peel

PCB Copper Track 90 Degree Peel

Speak to an expert

Got a question about a product? Request a call back from one of our Technical Sales Engineers now.

IPC TM-650_{IPC-TM-650 Test Methods - Carrier ReleaseThin Copper}

Standards

IPC TM-650

PCB Copper Track 90 Degree Peel

PCB Copper Track 90 Degree Peel

Speak to an expert

Global distribution

IPC TM-650IPC-TM-650 Test Methods - Carrier ReleaseThin Copper

Standards

IPC TM-650

PCB Copper Track 90 Degree Peel

PCB Copper Track 90 Degree Peel

Speak to an expert

Global distribution

IPC TM-650_{IPC-TM-650 Test Methods - Carrier ReleaseThin Copper}